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SMT Assembly Capabilities
Surface mounting technology, also called as SMT, is one type of method to product the electronic circuits by placing components on the surface of printed circuit board directly. SMT assembly is an alternative approach to the through-hole method. SMT is considered as more efficient and convenient in terms of PCB assembly. During the past years, most PCB manufacturers employed throug-hole assembly method to install the electronic components on the printed circuit boards. Nowadays, the SMT assembly approach has been widely employed in the electronic industries. The process of SMT assembly consists of printing solder paste, mounting components, reflow soldering, AOI or AXI.
Allchips is equipped with all the necessary machines to complete the whole SMT assembly process. And we provides SMT assembly from prototype, ramp up to mass production with manual or automated SMT production processes, including single or double-sided component insertions.
We are able to assemble the following SMT types:
1. Ball Grid Array (BGA)
2. Ultra-Fine Ball Grid Array (uBGA)
3. Quad Flat Pack No-Lead (QFN)
4. Quad Flat Package (QFP)
5. Small Outline Integrated Circuit (SOIC)
6. Plastic Leaded Chip Carrier (PLCC)
7. Package-On-Package (PoP)
8. Small Chip Packages (pitch of 0.2 mm)
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