Volkswagen's Top Brands Flag Chip Risk in Months Ahead
Volkswagen's top three brands mentioned that the ongoing shortage of automotive chips would intensify in the coming months, which makes it really difficult for the automotive industry
Although there are signs that the semiconductors supply will be eased, it is expected that the supply for semiconductors would still be challenging. Since the crisis hit the automotive industry at the end of 2020, it has caused huge loss to this industry, however, Volkswagen still managed to reach record profits for the first half of 2021, because they favour Porsches and Audis in terms of allocation of chips, which is a crucial components in the modern vehicles.
Audi pointed out that there are signs that the chip crisis would be very critical in the next coming months.
Apple supplier TSMC Reports Gas Contamination at Key Chip Plant
TSMC, the chip supplier for Apple in Taiwan, stated on Friday that some of its production lines in southern Taiwan were hit by a contamination of gases used in the chipmaking process.
According to TSMC, this contamination is not expected to cause obvious impact on operations. The factory, dubbed Fab 18, is the company’s most advanced chipmaking facility. All of the latest processors for upcoming iPhones and Mac computers are produced there, according to Reuters.
The incident comes when Apple are finalizing components and preparing for the final assembly for the latest iPhones and new Macs by the end of August. TSMC is now taking measures to stringent follow-up operations to ensure the production quality.
Nexperia Released New ASFETs
Nexperia released new 80V and 100V ASFETs with 166% increased SOA and 80% slashed PCB footprint yesterday, which is aiming at the hot-swap & soft-start applications in 5G telecom systems & 48V server environments and industrial equipment needing e-fuse and battery protection.
ASFET is a new type of MOSFET, which has been optimized for use in particular design scenarios. The new type of ASFETs of hot-swap has been integrated with the latest silicon technology and copper-clip package construction in order to strengthen the Safe Operating Area (SOA) and minimize the PCB area.
The new ASFETs, the latest devices, are manufactured on Nexperia’s new 8-inch wafer production plant in Manchester, UK, and they have production capacity ready for volume orders.
Login 
Inquiry List
